Copper Nanoparticles Grafted on a Silicon Wafer and Their Excellent Surface-Enhanced Raman Scattering
Qi Shao ,1,2 Ronghui Que ,1 Mingwang Shao ,1,* Liang Cheng ,1 and Shuit-Tong Lee 3,*
1Institute of Functional Nano & Soft Materials (FUNSOM) and Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Soochow University, Suzhou, Jiangsu 215123, P. R. China
2Department of Chemistry, Hefei National Laboratory for Physical Sciences at the Microscale, The University of Science and Technology of China, Hefei, Anhui 230026, P. R. China
3Center of Super-Diamond and Advanced Films, Department of Physics and Materials Science, City University of Hong Kong, Hong Kong SAR, P. R. China
Copper nanoparticles grafted on a silicon wafer are fabricated by reducing copper ions with silicon–hydrogen bonds and assembling them in situ on the Si wafer. The nanoparticles, with an average size of 20 nm, grow uniformly and densely on the Si wafer, and they are used as substrates for surface-enhanced Raman scattering. These substrates exhibit excellent enhancement in the low concentration detection (1 × 10 ? 9 M ) of rhodamine 6G with an enhancement factor (EF) of 2.29 × 10 7 and a relative standard deviation (RSD) of < 20%. They are also employed to detect sudan-I dye with distinguished sensitivity and uniformity. The results are interesting and signifi cant because Cu substrates are otherwise thought to be poor. These effects might provide new ways to think about surface-enhanced Raman scattering based on Cu substrates.