Instrument name and Model
Manual Wedge Bonder
Bonding Area: 134mm*134mm for wedge bonding
Z Height Control：DC Servo/LVDT Closed Loop Control
Deep Access Kit allows 12.7 mm deep access capability
High-Q Transducer: 60KHZ; Temperature Control: 250℃
The Wedge Bonder is used with Al wires (welding diameter is 20-76um), Au wires (welding diameter is 18-76um).
Tail Control system: A real –time Tail Control Algorithm
Applications and Uses
The Wedge Bonder for gold wire provides versatile production capabilities for bonding applications from simple discrete devices to complex hybrid and microwave devices.
Contact: Mingfa Peng