PVA Tepla America Inc.
1.Reaction chamber: Size 229 mm*330 mm*483 mm；
2.Process Gas: O2 and Ar;
3.Vacuum System: pre-condition 50mTorr; Process Pressure 120-2000mTorr
4.RF Power: Frequency 13.56MHZ, Power Adjust Range is 0-300W.
5.Control System: Automatic Control
Applications and Uses
The PVA TePla ION Series Plasma Processing System is a batch-mode plasma system for etch, strip, clean, and surface treatment, which could be widely used in the field of semiconductor technology and biotechnology. It combines field-proven features, which minimize machine-generated particulate with the process flexibility of computer control.
Contact: Mingfa Peng